Design Considerations

FPC Type Single sided (SS)
Double sided (DS)
Flex multilayer
Rigidflex multilayer
High volume panel or R2R
High volume panel or R2R
High volume to 4 layers
Low volume
Base Materials Polyimide (PI)
Polyester (PET)
Adhesive type and adhesive-less type available
Base Materials Thickness 25 μm + adhesive-less
50 μm + adhesive
12.5 μm available
25 μm available
Available Copper Thickness
(Weight)
12 μm (1/3 oz), 17.5 μm (1/2 oz),
35 μm (1 oz), 70 μm (2 oz)
Coverlay Materials Polyimide (PI)
Polyester (PET)
Coverlay Material Thickness 50 μm and up
(25 μm PI / 25 μm adh)
25 µm possible
(12.5 µm PI / 12.5 µm adh)
Soldermask Materials Flexible soldermask Printed or LPI (Liquid Photo Imageable)
Soldermask Thickness 20 μm – 25 μm typical
Min Line & Space 80 μm (based on 17 μm cu) 75µm available
Outline Tolerance ±70 μm Hard tool
±100 µm +
±200 µm Steel Rule Die
±250 μm +
Outline to outline feature
Trace to edge
Outline to outline feature
Trace to edge
Minimum Drilled Hole Size 80 μm
2 – 3 μm
Mechanical drill
Laser (R2R processing)
Available Surface Finish OSP -
Electro-plated Sn
Immersion Sn
Electro-plated Ni / Au
ENIG
Immersion Ag
0.2 μm – 0.5 μm thick
25 μm ± 10 μm thick
0.6 μm – 1.2 μm thick
3-5 μm Ni / 0.05 – 0.125 μm Au
3-5 μm Ni / 0.05 – 1.0 μm Au
0.2 μm – 0.3 μm thick
Components 0402 and up0 SMT
Flip chip available
Conventional Pb free solder or Polysolder™ conductive epoxy
Continuous Operating Temp 40 °C to +125 °C (PI)
20 °C to +85 °C (PET)
+150 °C available
Temperature / Humidity 1000 hrs 85 °C / 85% RH Temperature / Humidity

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