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Flexible Printed Circuits - Copper Conductors (FPC)

Flexible Printed Circuits - Copper Conductors (FPC)

Parlex reliably packages circuitry in limited space with Rigid-Flex or solves a crosstalk shielding issue with Multilayer Flex Circuitry. Our flexible printed circuit capabilities includes a wide range of design choices including line spacing, materials, surface finishes and panel sizes. Parlex is experienced in servicing multiple industries including Automotive, Industrial, Home Technologies, Medical and Life Sciences. Parlex engineers collaborate with customers to address the most demanding flexible circuit designs and we have the manufacturing expertise to support the project from prototyping to mass production.

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Units
Platforms / Part Numbers Base Material Cu Foil Type / Thickness Coverlay / Dielectric Material Typical Thickness
(µm)		 Stiffener Options Operating Temperature Range
(°C)		 Standard Data Sheets
Single Sided FPC Polyester (PET), Polyimide (PI) 18µm, 35µm, 70µm Rolled Annealed or Electrodeposited Copper - PET Film with PET Adhesive- Flexible LPI Soldermask- Screen printed coverlay, - PI Film with Acrylic or Modified Epoxy Adhesive- Flexible LPI Soldermask 100µm - 250µm, 78μm - 250μm (Standard); 53μm - 220μm (Adhesiveless) - PET Film with PET Adhesive- FR4- Aluminum, Stainless Steel, or Copper, - PI Film with Acrylic or Modified Epoxy Adhesive- FR4- Aluminum, Stainless Steel, or Copper 40 - 85, 40 / +125°C ; 40 / +150°C (Adhesiveless) IPC6013 Type 1
Platforms / Part Numbers Base Material Cu Foil Type / Thickness Coverlay / Dielectric Material Typical Thickness
(µm)		 Stiffener Options Operating Temperature Range
(°C)		 Standard Data Sheets
Double Sided FPC Polyester (PET), Polyimide (PI) 18µm, 35µm, 70µm Rolled Annealed or Electrodeposited Copper - PET Film with PET Adhesive- Flexible LPI Soldermask- Screen printed coverlay, - PI Film with Acrylic or Modified Epoxy Adhesive- Flexible LPI Soldermask 211µm - 415µm, 131μm - 415μm (Standard); 81μm - 415μm (Adhesiveless) - PET Film with PET Adhesive- FR4- Aluminum, Stainless Steel, or Copper, - PI Film with Acrylic or Modified Epoxy Adhesive - FR4- Aluminum, Stainless Steel, or Copper 40 - 85, -40 / +125°C; 40 / +150°C (Adhesiveless) IPC6013 Type 2
Platforms / Part Numbers Base Material Cu Foil Type / Thickness Coverlay / Dielectric Material Typical Thickness
(µm)		 Stiffener Options Operating Temperature Range
(°C)		 Standard Data Sheets
Multilayer FPC Polyimide (PI) 18µm, 35µm, 70µm Rolled Annealed or Electrodeposited Copper - PI Film with Acrylic or Modified Epoxy Adhesive- Flexible LPI Soldermask 309μm - 609μm (Standard); 161μm - 575μm (Adhesiveless) - PI Film with Acrylic or Modified Epoxy Adhesive- FR4- Aluminum, Stainless Steel, or Copper 40 - 125 IPC6013 Type 3
Platforms / Part Numbers Base Material Base Material Adhesive Cu Foil Type / Thickness Coverlay / Dielectric Material Typical Thickness
(µm)		 Operating Temperature Range
(°C)		 Standard Data Sheets
Rigidflex Multilayer FPC Polyimide PI flexible layers and FR4 rigid layers Acrylic, Modified Epoxy, 'Adhesiveless' (flex layers), Epoxy or PI (Rigid Layers) 18µm, 35µm, 70µm Rolled Annealed or Electrodeposited Copper Flexible LPI Soldermask 599μm - 2300+μm 40 - 125 IPC6013 Type 4