Design Considerations
Maximum Current | 50mA | Varies depending on ink selection |
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Line & Space | 250µm | 150µm available |
Silver Ink Resistivity | 5-15 mΩ/sq/mil | |
Components | 0603 minimum size Types: LEDs, Capacitors, Phototransistors, Diodes, Resistors |
Parlex own conductive epoxy used for attachment(Polysolder™) |
Domes | Ø4-12 mm | Depending on application |
Switch Life | 1 million operations | |
Typical Materials | 50 µm and over | PC, PEN, PET, PI |
Profile Cut - Trace Edge | 0.5mm | |
Cut Tolerance | SRD tolerance: ±0.25 mm Press tool tolerance: ±0.1 mm |
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Print Registration Tolerance | ±0.25 mm | |
Circuit Construction | Single Sided: Multiple conductive layers Double Sided: Multiple conductive layers available with printed through holes |
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Installation | Flex to install around 3.2mm or 100mm radius | 3.2mm without SMD components. 100mm with SMD components |
Humidity | 5-95% RH non-condensing | |
Operating Temperature | -20 to +85 °C | |
Storage Temperature | -55 to +105 °C | |
Thermal Aging | 1000 hours @85 °C/85 RH |